COMPOZITES AND MULTIPURPOZE COATINGS | |
ArticleName | Diffusion-hardening alloys: synthesis, properties and application |
ArticleAuthor | Yatsenko S. P., Skachkov V. M., Krasnenko T. I., Pasechnik L. A. |
ArticleAuthorData | Institute of Solid State Chemistry of Ural Branch of Russian Academy of Sciences, Ekaterinburg, Russia: S. P. Yatsenko, Head of Laboratory, e-mail: yatsenko@ihim.uran.ru |
Abstract | This paper describes the report of methods of mechanical and mechanically activated mastication of metal powders and inert filling agents into liquid fusible alloys. This process provides multilevel hardening of the matrix with various phases during subsequent dispersion hardening of the composite in the course of thermal treatment. Compositions of these paste-like mixtures are non-equilibrium, therefore forming of intermetallic compounds and solid solutions with high melting temperatures occurs as a result of chemical interaction between the mixture components. Conditions for fabrication of electrochemical coatings are described, using these pastes and providing permanent connection of heterogeneous materials (including glass, ceramic, silicon etc.). Compositions of water-salt solutions for coating metallic surfaces with gallium and copper were determined together with development of conditions of electrochemical process for fabrication of intermediate insulating layers for permanent connection of materials. There are given the solutions for varying of thermal expansion coefficients of the composite alloys from usual to zero values via heterodesmic compounds (divanadates) as filling agents. The limiting values of shearing and cleavage strength and wear resistance for obtained samples of compounds are presented. The air tightness of material connecting seams and the possible temperature range of application of these compositions are discussed. It was experimentally shown that developed compositional diffusion hardening alloys hold much promise in different spheres. |
keywords | Gallium, copper, copper divanadate, solder, thermal expansion, flux-free soldering, electrochemical application |
References | 1. Yatsenko S. P., Khayak V. G. Kompozitsionnye pripoi na osnove legkoplavkikh splavov (Composite solders on the basis of easily fusible alloys). Ekaterinburg : Ural Branch of Russian Academy of Sciences, 1997. 186 p. |
Language of full-text | russian |
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