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ArticleName Deposition of metal nanofilms on cylinder-shaped items
DOI 10.17580/tsm.2022.04.06
ArticleAuthor Tupik V. A., Margolin V. I., Kostrin D. K., Farmakovskiy B. V.

Saint Petersburg Electrotechnical University LETI, Saint Petersburg, Russia:

V. A. Tupik, Vice Rector for Research, Head of the Department of Microradioelectronics and Radio Technology, Professor, Doctor of Technical Sciences, e-mail:
V. I. Margolin, Professor at the Department of Microradioelectronics and Radio Technology, Academician at the Prokhorov Academy of Engineering Sciences, Doctor of Technical Sciences, e-mail:
D. K. Kostrin, Deputy Head of the Department of Electronic Instruments and Devices, Associate Professor, Candidate of Technical Sciences


Kurchatov Institute National Research Centre – Gorynin Central Research Institute of Structural Materials Prometey, Saint Petersburg, Russia:

B. V. Farmakovskiy, Academic Secretary, Associate Professor, Candidate of Technical Sciences


The use of the magnetron sputtering method ensures high adhesion of the applied thin nanoscale films and allows deposition of metal coatings (Cu, Ni, Ti, Ag, Au, etc.) on various substrates. The disadvantage of planar magnetron sputtering devices is the inability to apply coatings to the inner surface of cylindrical parts (for example, silvering of the inner walls of waveguides). The formation of such films is possible with the use of a rod cathode-target and a cylindrical anode-substrate coaxially located with it. In the space between the target cathode and the anode substrate, a low-temperature gas discharge plasma is created by applying a constant electric voltage, and a magnetic induction field perpendicular to the electric field is created by permanent magnets or solenoids located outside the cylindrical anode substrate. The disadvantages of such a device include the inability to control the characteristics of the permanent magnetic induction field in the case of permanent magnets and the inhomogeneous characteristics of the magnetic induction field in the case of solenoids. A significant disadvantage is the need to rebuild the entire system of external magnets in the event of a change in the requirements for the parameters of the magnetic induction field or a change in the configuration of the substrate. Therefore, it is necessary to exclude external sources of the magnetic induction field. In the proposed device, the magnetic induction field is created due to the flow of a constant current of the required value through the cathode. The use of alternating and direct current sources and a system of capacitors and chokes allows creating a controlled magnetic field of the required configuration and implementing a discharge in the crossed fields. This makes it possible to obtain a high-quality coating with heterogeneity of about 3% throughout the product.
This paper was recommended for publication by the Organizing Committee of the International Conference Nanophysics and Nanomaterials (24–25 November 2021, Saint Petersburg, Mining University).

keywords Nanoscale metal films,magnetron sputtering, cylindrical substrates, discharge in crossed fields, replaceable targets, rod cathode

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