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EPITAXIAL LAYERS AND MULTILAYERED COMPOSITIONS
ArticleName Analysis of heat propagation processes in structers of pulse powerful devices near planes of solder of silicon plates in high voltage stacks
ArticleAuthor A. L. Glazov, V. A. Kozlov, O. Korolkov, K. L. Muratikov
ArticleAuthorData

Ioffe Physical−Technical Institute of RAS

A. L. Glazov, K. L. Muratikov

 

FID Technology Ltd.

V. A. Kozlov

 

Tallinn Technical University, Estonia

O. Korolkov

Abstract

Processes of heat transfer through interfaces of semiconductor diode stack structures of high voltage pulse switchers are investigated by laser thermal wave methods. Theoretical model of thermal wave propagation in such structures is developed. It takes into account specific features of preparation of semiconductor element surfaces, layers of solder or bonding. It is shown that laser thermal wave methods can be applied to diagnostics of thermal contact quality between elements of opening switchers for various technologies of their assembling.

keywords Contact heat transport, soldered or bonded contacts, laser thermal wave diagnostics, high voltage switchers
References

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