Журналы →  Tsvetnye Metally →  2019 →  №12 →  Назад

AUTOMATION
Название Additive technology friendly design technique for design of heat exchangers for electronic applications
DOI 10.17580/tsm.2019.12.10
Автор Avtushenko А. А., Basov А. А., Maltsev I. E., Ripetskiy A. V.
Информация об авторе

Moscow Aviation Institute (National Research University), Moscow, Russia:

А. А. Avtushenko, Postgraduate Student

A. V. Ripetskiy, Deputy Head of Department, Candidate of Technical Sciences

 

S. P. Korolev Rocket and Space Corporation Energia (RSC Energia), Korolev, Moscow Region, Russia:
А. А. Basov, Division of Thermal Control Systems, Chief, Candidate of Technical Sciences, e-mail: Andrey.Basov@rsce.ru

 

Experimental Machinebuilding Plant of RSC Energia (CJSC), Korolev, Moscow Region, Russia:
I. E. Maltsev, General Director

Реферат

One of the major tasks in electronics and communications engineering involves ensuring the right heat regime for each element. Thus, to design a reliable electronic device it is important to foresee an optimum heat removal system. Due to their unique thermophysical properties, non-ferrous metals from aluminium and aluminium-magnesium groups are most commonly used in the design of air heat exchangers for electronic devices. Sintered aluminium alloys are characterized with high strength, stable mechanical properties in the required temperature range, high heat conductivity and (if having an electrodeposited coating) acceptable corrosion resistance. With the help of modern additive technology, a multi-level technique has been developed to achieve optimized geometric configuration in heat exchange devices, which is based on the interpretation of heat exchange processes as a system. The following characteristics were used to define the improved performance of a heat exchange device: air flow path; temperature of the contact surface; temperature of the air flow going through the heat exchanger; air flow and aerodynamic drag in the heat exchanger channels; weight of the device. A parameter grading method was applied when identifying the optimum model. As a result, a model air heat exchanger was created with ribbed heat removal elements, with the manufacturing of the latter optimized through the use of additive technology.

Ключевые слова Aluminium alloy, electronic devices, heat exchange device, heat exchanger, additive technology, geometric optimization, temperature field, distribution of temperatures
Библиографический список

1. Glinskiy I. A., Zenchenko N. V. Design of a heat distribution element for high-power microwave transistors. Russian Microelectronics. 2015. Vol. 44, No. 4. pp. 269–274.
2. Teverskiy L. Comprehensive design of electronic devices using 3D technology. Sovremennaya elektronika. 2017. No. 9. pp. 16–22.
3. Dyban E. P., Mazur A. I. Jet flow around a body and convective heat transfer. Kiev : Naukova dumka, 1982. 303 p.
4. Manilenko I. N. Developing design techniques to design finned and flanged heaters for electronic devices : PhD dissertation. Vladimir, 2012. 107 p.
5. Alekseev V. A. Heat accumulator systems for spacecrafts : Design basics. Kursk : Fond “Naukom”, 2016.
6. Pancnehko S. V., Bobkov V. I., Fedulov A. S., Chernovalova M. V. Mathematical modelling of thermal and physical-chemical processes during sintering. Non-ferrous Мetals. 2018. No. 2. pp. 50–55. DOI: 10.17580/nfm.2018.02.09.
7. Kashirin A. I., Shkodin A. V. Metallic coatings installed by gas dynamic spraying: Prospects and current status. Uprochnyayushchie tekhnologii i pokrytiya. 2007. No. 12. pp. 22–33.
8. Naumann R. J. Optimizing the design of space radiators. International Journal of Thermophysics. 2004. Vol. 25, No. 6. pp. 1929–1941.
9. Nikolaev V. I., Bruk V. M. Systematics: Methods and applications. Leningrad : Mashinostroenie, 1985.
10. Surmin Yu. P. System theory and system analysis : Learner’s guide. Kiev : MAUP, 2003. 368 p.
11. High-performance liquid coolers. KS series. Symmetron. Available at: http://www.symmetron.ru/suppliers/dau/ (Accessed: 07.04.2019).
12. Basov A. A., Dyadkin A. A., Leksin M. A., Prokhorov Yu. M. Air cooling method of heat generating equipment, located outside aircrafts, and system for its implementation. Patent RF, No. 2632057.
13. Strumilo C., Gostkowski V. The effect of free-stream turbulence on the momentum, heat and mass transfer during flow around a sphere (part 1 and 2). Wärme- und Stoffübertragung. 1978. Vol. 11, No. 4. pp. 277–292.
14. Makhmudov M. M. Cooling systems for the elements of electronic devices operating in intermittent heat generation regimes : PhD dissertation. 05.04.03. Makhachkala, 2008. 162 p.
15. Krokhin A. 3D: OK for printing! Additive technology in aluminium industry. Algoritm uspekha. 2017. No. 1. pp. 26–29.
16. Chernyshev A. A., Ivanov V. I., Aksenov A. I., Glushkova D. N. Ensuring proper temperature regimes for electronic devices. Moscow : Energiya, 1980. 215 p.
17. ASTM D3123–09. Standard Testing Method for Spiral Flow of Lowpressure Thermosetting Moulding Compounds. West Conshohocken: ASTM International, 2013.

Language of full-text русский
Полный текст статьи Получить
Назад