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ArticleName Additive technology friendly design technique for design of heat exchangers for electronic applications
DOI 10.17580/tsm.2019.12.10
ArticleAuthor Avtushenko А. А., Basov А. А., Maltsev I. E., Ripetskiy A. V.

Moscow Aviation Institute (National Research University), Moscow, Russia:

А. А. Avtushenko, Postgraduate Student

A. V. Ripetskiy, Deputy Head of Department, Candidate of Technical Sciences


S. P. Korolev Rocket and Space Corporation Energia (RSC Energia), Korolev, Moscow Region, Russia:
А. А. Basov, Division of Thermal Control Systems, Chief, Candidate of Technical Sciences, e-mail:


Experimental Machinebuilding Plant of RSC Energia (CJSC), Korolev, Moscow Region, Russia:
I. E. Maltsev, General Director


One of the major tasks in electronics and communications engineering involves ensuring the right heat regime for each element. Thus, to design a reliable electronic device it is important to foresee an optimum heat removal system. Due to their unique thermophysical properties, non-ferrous metals from aluminium and aluminium-magnesium groups are most commonly used in the design of air heat exchangers for electronic devices. Sintered aluminium alloys are characterized with high strength, stable mechanical properties in the required temperature range, high heat conductivity and (if having an electrodeposited coating) acceptable corrosion resistance. With the help of modern additive technology, a multi-level technique has been developed to achieve optimized geometric configuration in heat exchange devices, which is based on the interpretation of heat exchange processes as a system. The following characteristics were used to define the improved performance of a heat exchange device: air flow path; temperature of the contact surface; temperature of the air flow going through the heat exchanger; air flow and aerodynamic drag in the heat exchanger channels; weight of the device. A parameter grading method was applied when identifying the optimum model. As a result, a model air heat exchanger was created with ribbed heat removal elements, with the manufacturing of the latter optimized through the use of additive technology.

keywords Aluminium alloy, electronic devices, heat exchange device, heat exchanger, additive technology, geometric optimization, temperature field, distribution of temperatures

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